MG Chemicals SAC305 Lead-Free No-Clean Solder Paste

MG Chemicals SAC305 Lead-Free No-Clean Solder Paste is made from a blend of high-purity non-recycled tin silver and copper metal powder combined with a no-clean flux to form a paste. This solder paste is designed for surface mount applications and provides high tack force and good wettability. Post-soldering residues are transparent non-conductive non-corrosive and highly insulated. MG Chemicals SAC305 Lead-Free No-Clean Solder Paste is designed for use in high-speed printing especially with SMT solder paste printers with ultrafine stencils as small as 0.3mm.