IT
BGA Reballing Practice Kit
MEPA CODE:
013310637
BRAND:
Seeed Technology Co
MANUFACTURER CODE:
110990203
SKU CODE:
SE-110990203
110,60
€
(excl. VAT)
Full description
A kit with (almost) everything you need to reball your first BGA chip! Includes the exact brands and tools used by Hacker Camp Shenzhen to teach BGA reballing at a mobile phone repair school. Accompanies the Hacker Camp Shenzhen 2014 BGA workshop video from Dangerous Prototypes. Packing List:
- Recycled mobile phone (chip donor)
- Solder paste
- Flux
- Spatula
- Tweezers right angle (ST-15)
- Tweezers sharp (ST-11)
- Knife and flat blade
- BGA stencil
- PCB holder
- Screw driver
- Phone opening tools
- Cotton sticks
- Dangerous Prototypes stickers
You will need to bring your own (B.Y.O.):
- Soldering iron (any will work)
- Hot air rework station
- Acetone (or nail polish remover)
- Tissues